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Innovative Capability

Innovative Technology R&D

To continuously enhance the value of the Company, Unimicron actively takes the reference to and participates in the formulation of the technical blueprint for the international industry, and formulates five major strategies to meet the needs of various future products. Through the three strategies of patent portfolio, technological development and technological cooperation, we actively invest in environmental protection and low-cost manufacturing processes, and establish an industry centered on technological innovation and intellectual autonomy, to open up new business opportunities through innovation.

Patent Portfolio

With Unimicron’s strategy to stay rooted in Taiwan and expand globally, we have set up R&D centers in Taoyuan and Hsinchu, with different R&D strategies that are focused on developing technologies to satisfy customers’ needs and developing innovative technologies for the next three to five years. In addition to introducing advanced equipment and recruiting R&D talents of the industry, Unimicron has also invested heavily in research and development. Currently, the annual investment in research and development is about 2 - 3% of the annual income. The R&D expenditures invested in the past three years has grown exponentially, yielding patents for various products and technical capabilities.

Technological Development

In response to major future industry trends, Unimicron will continue to invest in research and development, and cultivate high-end product technology platforms, such as 5G high-frequency high-speed PCB products, ultra-small distance pitch LED module development, Cool PCB (High Thermal Conductive) module development, Nick-Free surface Finished (NF) new technology development, and high-end Photovia PCB technology development. After years of technology deployment and investment in research and development, results have been achieved. In the 5G IoT product development project, Unimicron developed cavity PCB materials and its design, making it one of the best solutions for IoT products with System in Package (SiP) technology. After the cavity PCB board material and its design technology mature, huge business opportunities are expected to take place. At this stage, facing that the fifth-generation (5G) mobile communications are about to enter the global commercial stage in 2021, Unimicron focuses on the R&D fields of high-frequency AiP circuit boards, mobile phone boards and array antennas, optoelectronic communication boards for optical modules, and high-speed circuit boards for various server switches and routers.

Relying on its expertise and experience in large panel manufacturing of PCBs/IC Carriers, Unimicron is equipped with the existing Coreless technology, based on the platform innovative multilayer film wiring technology, to integrates materials and equipment manufacturers in the semiconductor and panel industries to form a research and development alliance. It develops the advanced packaging technology of Panel-level Fan-Out (PFO) with RDL first (Die last) and ultra-fine circuit lines (2μm/2μm line width/line spacing) to break industrial problems and technical challenges of Fan-Out Panel Level Package (FOPLP), driving the development of the overall industrial chain.

In addition, in response to the future trend of high-density multi-functional chip systemization, based on the original platform of ultra-fine circuit technology, we adopted Multichip Heterogeneous Integration Packaging Technology, and the packaging size will be expanded from 20mm x 20mm to 55mm x 55mm. Embedded Trace Substrate (ETS) Carrier board technology continues to break through the bottleneck of fine lines and establishes a technology platform of L/S: 6/8 µm, laying the foundation for the next communication generation. We continuously develop the platform of L/S 5/5 um for laying the foundation of the future. As for the development of thick-board PCB technology, Unimicron took the lead in developing the Transient Liquid Phase Sintering (TLPS) docking technology platform board with a board docking alignment degree of <60μm, quickly extending the thick-board technology from 3.6 mm to 7.2 mm.

Technological Cooperation

Unimicron recognizes the important role value chain cooperation plays in driving the industry towards sustainable innovation. In addition to working with international manufacturers to develop next-generation high-end IC Carriers and interacting with customers, the Company also understands customer needs for technology and next-generation products, and keeps tabs on the blueprint for customers' future products. We strengthen cross-sector cooperation among domestic industries, create our industry and equipment products, strengthen research and development relationships between industry, academia and research institutes, drive the industry to set new specifications, and promote industrial restructuring or optimization. We will continue to meet customer expectations with the best quality and service model, lead the overall industry chain forward, and create more value.

R&D Cooperation Plan

Unimicron continuously collaborates with Suppliers, Academia, and Government to ensure that the product is in the leading position in the world.

● Cooperation with Suppliers

To ensure that the product is in the leading position in the world, we maintain close cooperation with excellent material and equipment suppliers, introduce high-performance materials and cutting-edge equipment for new product development, and cooperate with domestic equipment firms. Especially, 5G higher-frequency communications and the Low Df material process of high frequencies signal loss need to cooperate with material suppliers early.

● Cooperation with Academia

We work closely with domestic and overseas research institutes and academia, which includes joining the System Packaging Consortium of Industrial Technology Research Institute (ITRI), Germany IZM, and Georgia Institute of Technology (the U.S.) to co-develop a number of new products and technology. We work closely with a number of well-known universities such as Taiwan National University, National Tsing Hua University, National Chiao Tung University, National Central University, Yuan Ze University, Chang Gung University, and Chung Hua University. We have also established a cross-disciplinary research and development program to accumulate research and development at National Tsing Hua University and Yuan Ze University. From 2016 to 2020, we had invested NT$45.72 million.

● Cooperation with the Government

We received tax exemptions, investment tax credits and incentives for equipment, and subsidies through Industrial TDP from the government. From 2016 to 2019, Unimicron had two “A+ Industrial Innovation R&D Programs” (A+ program) approved by the Ministry of Economic Affairs and we are leading one of the programs to collaborate with four other companies. Unimicron received more than NT$ 86.46 million in subsidy from the government to develop panel-level ultra-fine pitch Fan-out technology. We will adopt Multichip Heterogeneous Integration Packaging Technology and expand the package sizes to apply in 5G high frequency and high-speed communication that reduce Insertion Loss and improve electrical performance.

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