Innovative Technology
To continually enhance the Company's value, we align with international standards and anticipate future needs. Our approach includes three strategies: patent portfolio, technological development and cooperation. We focus on investing in environmental protection and cost-effective manufacturing, fostering an innovation-driven industry centered on intellectual autonomy, and creating new business opportunities.
Breakthrough Innovation
- Establishing Technology and Product Innovation
- Integrating Resources and Teamwork
- Strategic Benchmarking Learning with Partners
- Refine System Processes and Management
Discover New Opportunities
- Gain Insight Into Industry Opportunities
- Mastering Technology Market
- Rapid Response to Market and Customer Needs
Enhance Corporate Value
- Promoting Environmental Protection and Sustainability
- Fulfillment of Corporate Social Responsibility
Patent Portfolio Strategies
To solidify Unimicron’s leadership in technology, we have established three key patent strategies: "Innovative Technology Protection," "Patent Strategy Development," and "Patent Map Compilation." These strategies enhance our patent positioning and strengthen the company’s value and competitiveness. We are advancing technologies related to heterogeneous integration and have secured patents in multiple countries to protect our innovations. Our internal patent system safeguards R&D achievements, and through collaboration with customers and suppliers, we leverage this portfolio to reinforce our market leadership in the knowledge economy.
Innovative Technology Protection
- Application for R&D Innovation Retention
- Sharing Industry Cooperation Results with Partners
- Jointly Hold Patented Technology with Partner
Patent Strategy Development
- Advanced Technology Development
- Patent Strategy Research and Planning
- Patent Risk Assessment and Avoidance
Patent Map Compilation
- Patent Classification Control Mechanism
- Periodic Review of Patent Assets
- Expanding License Utility
Patent Achievements(Unit: Cases)
| Region | Type | 2020 | 2021 | 2022 | 2023 |
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| Taiwan | Patent Applications | 50 | 67 | 58 | 48 |
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| Patent Granted | 36 | 59 | 61 | 60 |
| America | Patent Applications | 42 | 64 | 63 | 26 |
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| Patent Granted | 33 | 33 | 41 | 36 |
| Mainland China | Patent Applications | 70 | 89 | 90 | 74 |
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| Patent Granted | 49 | 66 | 60 | 46 |
| Others | Patent Applications | 0 | 1 | 0 | 0 |
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| Patent Granted | 1 | 0 | 1 | 0 |
Patent Incentive Program
To boost competitiveness and safeguard intellectual property, we launched the "Patent Incentive Program," offering bonuses and awards to encourage innovation. In 2023, 78 employees submitted patent ideas, resulting in 115 approvals. Alongside proposal and approval awards, we implemented a point system that rewards employees based on their number of submissions and approvals. The top three employees with the highest points receive gift certificates and certificates of merit. This initiative drives employees to engage more actively in R&D and patent applications.
Research and Innovation
Unimicron’s strategy merges a solid domestic presence with global expansion, establishing R&D centers in Taoyuan and Hsinchu, including Shanying II and Yangmei Plants, and KF plant is expected to start in 2026. We are dedicated to advancing various innovation and R&D initiatives, focusing on customer demands and future technologies over the next three to five years. In addition to acquiring advanced equipment and top R&D talent, we are committed to developing patentable, leading, and stable technologies. Our efforts also include significant investments in environmental protection and high-end manufacturing processes to establish a foundation centered on technological innovation and intellectual property. However, challenges such as the pandemic(COVID 19), international conflicts, high inflation, and excessive inventory led to a revenue decline this year, impacting R&D expense allocation. We will adjust our R&D expenses, focusing on high-tech and long-term equipment to maintain technological leadership, while preserving the momentum of breakthroughs. R&D spending will be adjusted based on economic conditions and demand.
R&D Expenses
| Year | 2020 | 2021 | 2022 | 2023 |
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| R&D Expenses (NT$ in 100 million) | 39.38 | 47.16 | 58.87 | 49.23 |
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| Revenue (NT$ in 100 million) | 878.93 | 1,045.63 | 1,404.89 | 1,040.36 |
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| Ratio (%) | 4.5% | 4.5% | 4.2% | 4.7% |
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Note: The data is the same as the consolidated information in the annual report.
Technological Development
In response to future industry trends, Unimicron continues to invest in R&D and develops high-end product technology, such as 5G high-frequency high-speed PCB, ultra-small distance pitch LED module, Cool PCB High Thermal Conductive module, Nick-Free surface finished, and high-end micro blind via PCB technology.
With the global commercialization of 5G mobile communications, we focus on 4 keys: smartphone/NB HDIs; antenna-in-package high-frequency PCBs, radar boards, and antenna arrays; optoelectronic boards for optical modules; and high-layer and high-speed PCBs for servers, network switches, and routers. Core technology includes the mSAP (L/S=18/22 μm) fine line process, embedded Cu inlay technology with rapid heat dissipation, coaxial via technology for low energy loss, the mechanical drilling and copper plating technology for boards with a thickness of 6 mm and a high aspect ratio (40:1).
Leveraging its expertise in large-panel PCB/IC Carrier manufacturing, Unimicron utilizes Coreless technology and innovative multilayer film wiring to forge a research alliance with material and equipment manufacturers in the semiconductor and panel industries. We develop the RDL first (Die last), the advanced packaging technology of the Panel-level Fan-Out (PFO) of the fine line process (2μm/2μm line width/line spacing) to break industrial problems and technical challenges of Fan-Out Panel Level Package (FOPLP), driving the development of all value chain. Additionally, to meet the future trend of high-density, multifunctional chip systems, we develop the technology of multichip heterogeneous packaging. Future packages will expand in size from 20mm x 20mm to between 55mm x 55mm and 77mm x 77mm.
With the Embedded Trace Substrate technology, we introduced new equipment and chemicals during the reconstruction of S1 Plant to support the loading and unloading methods, FM control, and improve L/ S=6/8 μm quality to meet customer certification. High-volume manufacturing trials began in Q3 2023. We've developed L/S=5/5 μm carrier insulation materials (Ajinomoto Buildup Film) and B-stage prepreg (PP) composites with VIP customers, utilizing various dry film materials and exposure machines, and developing low-roughness surface treatment chemicals to support the next-generation of communication technology.
| Item | Comparison with the Previous Year |
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| RDL Interposer Composite Carrier for High-Speed Applications | Completed multi-chip heterogeneous integrated packaging, with sizes expanded from 20 mm x 20 mm to 55 mm x 55 mm and up to 77 mm x 77 mm, there are five layers of Redistribution Layer (RDL), and the blind micro via diameter (20 um to 15 um), L/S down to 2/2 um. |
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| New Technology for Embedded Circuit Carrier Board | To meet customer demands for sub-2 nm chip nodes and high-density Chip packaging, we're advancing L/S 5/5 μm platform. We're also working with suppliers to refine copper column and solder mask thinning processes. This year, we're introducing ABF/PP composite stacking and low-roughness pre-treatment solutions to reduce blind hole diameters from 50 μm to 35 μm, enhancing the stability of fine lines and space pitches. |
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| Hybrid Copper Damascene Technology | The copper block thickness from 0.2 to 2 mm, with embedded technology size expanded from <6x15 mm to 18x18 mm. |
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| RCC applied to Optical Mode Products | Replacing traditional PP with Resin Coated Copper (RCC) improves high-speed product transmission time delays. RCC’s glass-free nature allows for better laser processing, reducing hole diameters and increasing wiring space. |
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| Diode Buried Technology and Heat Sink | Completed the first process development between the aluminum surface of the die pad and build-up layer materials, and electroplating copper. Resistivity was verified to be <10% after 15 cycles of Reflow and Thermal Shock Test 2000 cycles. Prototypes, including customer’s test chip, were sent for structural analysis. |
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RDL Interposer Composite Carrier for High-Speed Applications
New Technology for Embedded Circuit Carrier Board (ABF/PP Composite Stack and Low-Roughness Surface Treatment)
Single-shape Cu Inlay
Hybrid Cu Inlay
Embedded Heat Slug
| Board thickness | 1.0 mm | 1.0 mm | 1.0 mm | 2.0 mm |
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| Top view |  |  |  |  |
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| Side view |  |  |  |  |
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RCC applied to Optical Mode Products
Technological Cooperation
We recognize that value chain collaboration is crucial for sustainable innovation. We partner globally to advance high-end IC carriers and engage with customers to align with their technological needs and plans. By fostering cross-sector cooperation, developing industry and products and strengthening R&D partnerships with academia and research institutions, we aim to set new industry standards and drive optimization. Our commitment is to exceed customer expectations with exceptional quality and service, leading the value chain and enhancing overall value.
Fostering Cross-Sector Cooperation
AIoT and 5G drive diverse industrial applications, demanding advanced heterogeneous integration technologies. Semiconductor manufacturers worldwide are developing processes for heterogeneous chip integration. By 2025, with the industry advancing to the 2nm wafer node, substrate interconnection pitches will shrink to ≦ 40μm, which requires System-in-Package (SiP) solutions, small chips, and heterogeneous integrated packages. Unimicron supports advanced substrate heterogeneous integration for IC carriers. We began developing a multi-chip heterogeneous integration packaging platform in 2021, starting with 20mm x 20mm packages. This size expanded to 55mm x 55mm in 2022, reaching 77mm x 77mm in 2023.
Developing Industry and Products
The early 2020 pandemic (COVID19) and subsequent border controls significantly disrupted the global supply chain. In response to climate change, countries have set net-zero emission targets, driving major ICT brands to mandate that their supply chains meet RE100 for 100% green energy use. Carbon credit and tax initiatives will impact plant locations, gradually eliminating suppliers without clear carbon reduction strategies. The global industry chain is shifting focus from geographic and trade costs to prioritizing environmental values and national security costs. In the semiconductor industry, major companies frequently collaborate with leading manufacturers from Japan, Korea, Europe, and the United States. Unimicron collaborates with equipment manufacturers, such as those supplying copper plating and etching machines, and material suppliers for 5G substrates and anti-solder materials. This collaboration accelerates R&D in low-carbon technologies and bolsters our market competitiveness in response to climate change risks.
Strengthening R&D Partnerships with Academia and Research Institutions
In response to localized supply chains and the drive for material and equipment self-sufficiency, we have teamed up with industry, academia, and research institutes to develop cutting-edge technologies and equipment. For example, we are collaborating with academic institutions to advance laser cleaning technologies and AI inspection systems, and with equipment manufacturers to develop cutting-edge self-alignment Pick & Place machines. Additionally, we collaborate with the School of Electrical and Mechanical Engineering to co-develop products. The school designs test circuits, we handle production and electrical testing, and customers perform final verification and packaging tests, driving innovation.
Set New Industry Standards
The development of 5G high-speed and high-frequency applications, advanced substrates for heterogeneous IC carriers, high-end micro-LED carriers, Optoelectronic Module, and Radar Antenna Module marks a new industry. The industry has yet to establish quality certification specifications or testing standards. We will align resource investments with customer timelines, aiming to meet their standards first, set the industry benchmark, and establish the standard process. In 2023, we collaborated with customers to develop Radar Antenna Module and exhibited it at the TPCA show.
R&D Cooperation Plan
Unimicron continuously collaborates with suppliers, academia, and government entities to ensure our products remain world leading.
| | 2023 Cooperation | 2023 Benefits |
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| Suppliers | We continue to collaborate with top material and equipment suppliers to integrate high-performance materials and advanced technology into new products. Also, we work closely with domestic suppliers, particularly on high frequency 5G communications and low Df materials to minimize signal loss. | The global supply chain market is highly competitive. Unimicron's collaborations with suppliers have advanced our technologies and reinforced our industry leadership. This also helps Taiwanese industries maintain their position, secure key roles in global value chains, and enhance their autonomy and competitiveness. |
| Academia | To enhance R&D collaborations with industry, academia, and research institutes, we invested NT$17.75 million in partnerships with Taiwan University, Tsinghua University, and Yuan Ze University in 2023. This initiative aims to leverage research outcomes, activate domestic research capabilities, and foster cross-disciplinary scientific research, accelerating our R&D learning curve and developing technological talent. Additionally, we have joined Germany's R&D Consortium and Georgia Tech's Packaging Research Center to co-develop new products and technologies. | By merging academic theories with industrial production and development practices, we can quickly bridge the gap between theory and practice, effectively integrating cutting-edge academic research into industrial technology. An important aspect of industry-academia collaboration is comprehensive planning, which includes faculty and equipment exchange, graduate student training, and funding. By operating research independently within academic guidelines, institutions can secure reasonable profits, attract top talent and foster a virtuous cycle. |
| Government | We received government support, including tax exemptions, investment tax credits, and incentives for equipment and R&D investments. Through the government's priority counseling program, we submitted a new technology development plan and gained industry-specific grants. | Government funding accelerates Unimicron’s technological development, enhancing product competitiveness. This includes advancing Panel-level ETS fine-line Fan-out and developing the multi-chip heterogeneous integration platform to expend package size for improved electrical performance in 5G high-frequency and high-speed communications. What’s more, this support helps the government understand domestic industries' R&D potential and challenges, guiding future policy development. |
