FCBGA Technology Roadmap

#	Time Frame	2018		2019	2020
#	Time Frame	Production	Sample
1	Structure	8 / 2 / 8	8 / 2 / 8	11 / n / 11	11 / n / 11 ~
2	Max. Body Size (mm)	65 x 65	77.5 x 77.5	77.5 x 77.5 ~
3	FC Bump Pitch Array Type (SOP)	130	90 *	90 *	80 *
4	FC Bump Pitch Peripheral Type (BOL)	40 / 80	30 / 60
5	SRO / Bump Pad (w / Escape Trace)	65 / 90	45 / 67 ( 7 / 8)	45 / 67 ( 7 / 8)	40 / 64 ( 4 / 6)
6	SRO / Bump Pad (w / o Escape Trace)	40 / 80	30 / 60	30 / 60	30 / 60
7	Surface Finish ( Bump / SMD / BGA )	OSP
8	Presolder (Bump / SMD / BGA)	SAC 305,Sn / Cu
9	BU Layer Line / Space	9 / 12	7 / 8	7 / 8	4 / 6
10	BU Layer Vla / Land Diameter	60 / 85	30 / 55	30 / 52	25 / 45 ~ 20 / 40
11	Core Layer L / S (Subtractive)	25 / 25	20 / 25	20 / 25	15 / 25
12	Core Layer L / S (MSAP)	20 / 20	15 / 20	14 / 18	12 / 16
13	PTH / Land Diameter (0.8mm Core)	150 / 250	150 / 240	150 / 240	150 / 240
14	PTH / Land Diameter (0.4mm Core)	100 / 200	100 / 190	100 / 190	100 / 190
15	Core Thickness	≥ 400		≥ 400
16	Core Material	Low CTE (10 ~ 2 ppm)		Ultra Low CTE ( < 1ppm )
17	Build up Material	CTE ~ 20 ppm		CTE ~ 20 ppm
18	Solder Resist Material	CTE ~ 20 ppm		CTE < 10 ppm
* Ball placement available upon request