World Leading PCB Company
Make manufacturing smarter, build smart factories, and meet customer needs
Innovative Capability
After years of technology deployment and investment in research and development, results have been achieved.
Global 5G mobile communications commercial stage
Unimicron focuses on the R&D fields of high-frequency AiP circuit boards, mobile phone boards and array antennas, optoelectronic communication boards for optical modules, and high-speed circuit boards for various server switches and routers.LATEST NEWS
RECENT EVENTS
Quick link
Product overview
HDI,CSP,modules,PBGA,CSP,BGA,SIP,Embedded Passive Product,LED PCB,optical module PCB, optical transceiver PCB,high speed PCB,high frequency PCB,high layer count PCB, 5G PCB,5G CPE PCB, automotive PCB,ECU PCB, RADAR PCB,semiconductor test PCB,IC test PCB, back panel PCB.
Multi-layer PCB
PCBFrom 2 to 12 layers、Supports fine line & narrow pitch CSP mounting、Good impedance control...
Rigid PCB
PCBMobile Phone Module,Battery Module,Wearable Module,Camera Module,LCD Module,Rigid PCB,SSD Module
FPC
PCBMobile phones, large and small size panels, optical storage devices, hard disk drives, digital cameras...
FCCSP
IC CarrierPackage Size: 3 x 3 mm up to 15 x 15 mm、Line & Space 12/16um、Bump Pitch down to 130um...
FCBGA
IC CarrierPackage Size: 8mm x 8mm to 至 110mm x 110mm、Line & Space 8/8 um、Bump Pitch down to 90 um...
CSP
IC CarrierPackage Size: 3 x 3mm up to 19 x 19 mm、Thickness: 0.10mm - 0.36mm、Ball Pitch: 0.8mm, 0.65mm, 0.5mm, 0.4mm...
Memory Module
IC CarrierOverall substrate thickness down to 0.09mm、Critical for substrate flatness、Green/Black solder mask on each...
Coreless
IC CarrierLayer count : 1L / 2L / 3L / 4L , etc.、Thickness: 100 um (1.5L) ~ 225 um (5L)、Embedded trace (Line & Space...
PCBeam
ConnectorLow Pofile、Highest Performance、Extremely Rugged、SMT Process、Flixable design with FPC & I/O Port...
X-Beam
ConnectorThinest Connector of World、Highest Performance、Extremely Rugged、Rapid Customization...
Glass Type
TP & ECRMOGS (One Glass Solution):Thin,Light weight,Pass drop test、GG(Glass-Glass):High specification requirements...
Film Type
TP & ECRMGFF(Glass-Film-Film): Thin,Light weight、GF(Glass-Film)–OFS(One Film Solution) & OLS(One Layer Solution)...
EC Mirror
TP & ECRMOffer automotive anti-glare rearview mirror with intelligent anti-glare function,touch knowhow and voice...
