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FCCSP
Home
Products
FCCSP
Features
Package Size: 3 x 3 mm up to 19 x 19 mm
Line & Space 10/15um
Bump Pitch down to 90um
Impedance control for critical signal traces
Structure ranges from 2 layers to 16 layers
For products demanding high density and reliability
For small package size with high electric performance product
Certified for AEC-Q100 grade 0 reliability test
low Dk/Df materials available for high frequency application
Benefits
High I/O count
Short interconnects
High layout density
Applications
Portable Smart Devices e.g. Smartphone
Consumer Electronics
5G application
AiP module
LEO
Want to know more about our products? Welcome to contact us
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