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FCBGA
Home
Products
FCBGA
Features
Package Size: 8mm x 8mm to 110mm x 110mm
Line & Space 8/8 um
Bump Pitch down to 90 um
Impedance control for critical signal traces
Structure range from 1/2/1 to 10/n/10
Certified for AEC-Q100 grade 0 reliability test
Used for 2.5D & chiplets packaging
low Dk/Df materials available for high-speed communication
Embedded device structure available
Benefits
High/mid/low end chip product lineup
Good electrical performance
Applications
PC CPU/GPU
High Performance Computing, AI
Server/Switch
5G Networking Infrastructure e.g. base station
ASIC devices e.g. crypto
ADAS/Infotainment
Want to know more about our products? Welcome to contact us
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