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HDI
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Products
HDI
Features
Suitable for BGA with smaller ball pitch and higher I/O counts
Fine line, micro via and registration technologies capable of 0.3 mm ball pitch, Increase routing density in complicated design
Thin board capability, copper filled via and excellent mounting stability and reliability
Lower Dk / Df material enables better signal transmission performance (ex: 5G procuts)
Low CTE & High Tg material fulfills high reliability demand
Qualified material and surface treatment for Lead-free process
Benefits
1. World leading HDI manufacturer
2. Over 10 years’ experience in HDI manufacturing
3. Well experienced manufacturer with good yield
4. From both China and Taiwan, multiple plants increase production output in short time
Applications
Smartphone, Tablet, Notebook
Automotive, GPS, 5G Networking, OA
Wearable device, Portable Game Console, DSC, Display
Want to know more about our products? Welcome to contact us
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