About Unimicron
Company Info
Milestone
Organization
Vision And Management Philosophy
Global Service Network
Other
News
Group Companies
Supply Chain Portal
ESG
Technical Cooperation
Technical Cooperation
Technical Cooperation
Product Development
Patent
Technology Roadmap
HDI ELIC Roadmap
HLC Roadmapp
CSP Technology Roadmap
FCBGA Technology Roadmap
Products
PCB
HDI
ELIC
Multi-Layer PCB
Rigid Flex PCB
FPC
IC Carrier
FCCSP
FCBGA
CSP
Memory Module
Coreless
Connector
PCBeam
X-Beam
TP & ECRM
Glass Type
Film Type
EC Mirror
IC BURN-IN & TEST
IC BURN-IN & TEST
Quality
Policy & Action
Policy & Action
Customer Recognition
Certification
TQM's Implement
Careers
Join Unimicron
Join Unimicron
Training And Development
Workplace And Welfare
Health And Care
Investors
Financial Information
Monthly Sales Revenue
Financial Reports
Investor Conference
Corporate Governance
Corporate Regulations
Directors
Committees
Corporate Governance
Shareholder Services
Shareholders' Meeting
Quotes & Dividend
Major Shareholders
Contact us
繁中
/
EN
/
日本語
ELIC
Home
Products
ELIC
Features
Every layer via structure to achieve miniature design
Copper filled via provides better reliability
Superior electrical characteristics
Benefits
Over 15 years’ experience in ELIC manufacturing
Large ELIC capacity support
Using advanced equipment for stable ELIC production process
Well control in ELIC design tolerance (ex. L/S) for superior performance
SLP (substrate-like) technology
Excellent reliability performance
Applications
Smartphone, Tablet, Ultrabook
LED
Graphic card
Wearable device, DSC, Camcorder
Optical Transceiver
Want to know more about our products? Welcome to contact us
contact us
LinkedIn
Facebook
