HLC Roadmapp
| # | Time Frame | 2019 | 2020 | 2021 | |
|---|---|---|---|---|---|
| Production | Sample | ||||
| 1 | Impedance(%) | ±10 | ±8 | ±6 | ±6 |
| 2 | Min.Laser Via | 160 | 160 | 150 | 150 |
| 3 | Min.Laser Land | 300 | 300 | 270 | 250 |
| 4 | Max. Aspect Ratio | 0.9 | 0.9 | 1 | 1 |
| 5 | Min. PTH Via Size | 200 | 200 | 200 | 150 |
| 6 | Min. Back Drill Design | D+150 | D+150 | D+100 | D+75 |
| 7 | Surface Finish | OSP / Inmmersion Ag | ENIG / ENEPIG | ENIG / ENEPIG | |
| 8 | Min. Back Drill Design | D+150 | D+150 | D+100 | D+75 |
| 9 | Layer Count | < 18 | < 24 | < 42 | < 62 |
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隱私權政策
|
網站地圖
|123
© 欣興電子
|
電話：+886-3-350-0386