CSP Technology Roadmap

#	Time Frame	2019		2020	2021
#	Time Frame	Production	Sample
1	Line / Space (Semi-Additive)	20 / 20	15 / 20	14 / 18	12 / 16
2	Line / Space (Subtractive)	25 / 25	20 / 25	20 / 25	15 / 25
3	Through Via / Pad (Laser)	75 / 125	70 / 115	65 / 105	65 / 100
4	Through Via / Pad (Mechanical)	100 / 200	100 / 190
5	Micro Via / Pad (Laser)	65 / 100	60 / 90	50 / 80	50 / 80
6	FC Bump Pitch Peripheral Type (BOL)	40 / 80	30 / 60
7	Bond Finger Pitch (Finish W / S)	75(40 / 15)	70(40 / 15)	70(40 / 15)	65(40 / 12)
8	Solder Resist Registration (WB CSP)	25	20	20	15
9	Solder Resist Registration (FC CSP)	12.5	10		10 ~
10	Surface Finishing (WB CSP)	NiAu.AFOP.NPL.Etch Back.ENEPIG		NiAu.AFOP.NPL.Etch Back.ENEPIG
11	Surface Finishing (FC CSP)	OSP / ENEPIG / Immersion Tin		OSP / ENEPIG / Immersion Tin
12	Substrate Total Thickness (2 Layers)	100	80
13	Substrate Total Thickness (4 Layers)	170	140
14	Laminate Material	CTE ~ 2 ppm	CTE ~ 1 ppm	CTE < 1 ppm
15	Solder Resist Material	CTE ~ 30 ppm	CTE ~ 20 ppm	CTE < 10 ppm
* Ball placement available upon request