Design & Sim Service
An introduction to Unimicron’s EDA team
EDA’s visions : Technologic Insights and professional capabilities
Initially established in millennium, Unimicron's EDA (Electronic Design Automation) division plays a critical role in enabling advanced packaging and interconnect technologies through the simulation analysis and validation capabilities. Some key insights and capabilities include: Electrical simulation combined with statistic and dynamic analysis , design synergy with advanced manufacturing processes bring forth the optimal product performance and sustainable reliability.
EDA Profile
These insights demonstrate Unimicron's comprehensive EDA capabilities spanning computational simulation, mathematical analysis, substantial validation, which also showcase design for advanced packaging and interconnect technologies across diverse applications. Unimicron design service come up with turnkey solutions specifically tailored for singular PDK (Process Design Key) with DFM for distinct Unimicron Fab. In short, our design capabilities and applications break down into the diverse features as follows.
High-performance computing (HPC) & 2.5 D form factor
Enable collaborating co-package optics (CPO) for networking switches and routers with customers. Supporting advanced accelerators like APU/NPU substrate layout with AI/NL functionalities . Likewise, follows the UCIe standard, optimizing thermal management and signal integrity for high-speed interconnects for D2D (Die to Die) fan-out from advanced Chiplet to complicated 2.5D package integration.
5G and mmWave applications
Antenna in Package (AiP) has democratized as the mainstream antenna packaging technology for various millimeter-wave (mmWave) applications especially in the portables. Unimicron EDA team is eligible of designing antenna-in-package (AiP) modules for 5G base stations and devices by integrating vertically into the product from scratch. Ensuring signal integrity and thermal management for mmWave components modeling through the simulation and verification.
Burning Board/ Probe cards solutions
Probe cards are hi-tech devices in the semiconductor test for verifying the functioning of chips during their construction processes. We’re able to collaborate with customer’s knowhow to provide turnkey solutions for burn-in board /PC design and manufacturing, which meanwhile can implement the electrical and mechanical performance in the backend modeling.
Rigid-flex and embedded passives
Embedded passive components, such as resistors and capacitors, offer several advantages in electrical performance: Reduced Parasitic Inductance, improve signal integrity and PDN, space and weight savings. Cost efficiency. Enhanced reliability. These advantages make embedded passives a compelling choice for modern electronic designs, driving their adoption in various high-performance applications.
Advanced HDI integration W/O conventional back drilling
Optimizing HDI processes to minimize signal degradation and impedance fluctuations. Exploring copper roughness and terrain morphology through simulation. These diverse scenarios showcase Unimicron's ability to apply its EDA capabilities to a wide range of applications, from high-performance computing and 5G to advanced packaging and validation solutions.
SI/PI integrity with interstitial stackup via & coaxial for improving SI and S-para
The impeccable impedance control co-axial design is an unique technology integration from design to simulation by taking the manufacturing processes into account. The coaxial via structure comprises a central conductive via and an external conductive concentric separated by a dielectric material , We can not only design but also can optimize the impedance from the simulations such as impedance discontinuities, transmission line models, and via topologies. Assess signal integrity, power integrity, and electromagnetic interference through the thermal and stress analysis.
Thermal-Stress coupling simulations
Thermal-Stress Coupling Simulations refer to computational analyses that model the interaction between thermal loads and mechanical stress within a material or structure. These simulations consider how temperature changes can induce stress and deformation, and how these stresses can, in turn, affect temperature distribution due to thermal expansion or contraction. This type of simulation is crucial in engineering fields where materials are subjected to varying thermal environments, ensuring structural integrity and performance.
RDL downsize, Layer Reduction
The merits for RDL are 1. Increased comp density and miniaturization: making them ideal for compact and high-performance electronic devices. 2. Improved Signal Integrity and High-Frequency Performance: The finer trace widths and tighter spacing between traces in HDI enhance SI/PI 3. Reduced Layer count and overall board thickness, by increasing the number of routing channels on internal layers, 4. Enhanced thermal management . The design and materials used in HDI improve thermal propagation in heat dissipation, which is crucial for maintaining performance and reliability. 5. Potential cost savings and improved reliability. Reducing the layers and might possibly optimize the layout can lead to cost savings in manufacturing and assembly.
Simulation with verification
For ensuring the simulation and measurement will be aligned coherently throughout the manufacturing processes, complicated TDR, VNA with probe contact, and shadow more instruments will be used for validation. There are several advantages for bi-lateral validation from simulation to verification. 1.Accuracy and credibility, 2. errors detection and correction, 3. consistency with mathematic models.4improved decision-making from the S-parameters 5. Enhanced confidence in results with confidential agreement.
