研發總部
新產品研發
先期合作開發
技術研發藍圖
首頁
>
技術研發
>技術藍圖
PCB技術研發藍圖
PCB
CARRIER
2007
Q1
Q2
Q3
Q4
2008
Q1
Q2
Q3
Q4
2009
Q1
Q2
Q3
Q4
Line/space
50 / 50 μm
40 / 40 μm
30 / 30 μm
~ Methodology
Laser Direct Image / Stepper
Semi Additive
Microvia Size
75 μm
65 μm
50 μm
Capture / landing Pad
150 / 150 μm
130 / 130 μm
Landless
Laser type
CO2 DLD
UV-YAG
S/M registration
25 μm
20 μm
15 μm
~ CSP Pitch
400 μm
300 μm
~ Tool
Stepper / Shutter
Laser Direct Image
Materials
Low CTE / Modulus
Thermal Conductive
Liquid Crystal Polymer
Wave guide / PLC
Product Application
Rigid-flex
Embedded Passives
Embedded ICs / Circuit
Process Innovation
Plating filled
Direct Circuit / Ink-jet
Cu Bump
Metal Paste
TEL:886-3-3500386 FAX:886-3-3500372
copyright 2007 Unimicron Corporation. All Rights Reserved
TEL:886-3-3500386 FAX:886-3-3500372