Unimicron’s R&D focused on continual innovation of PCB related technology. Our goal is to develop cutting edge products with advanced technology that fulfill customer’s current and future demands. By benchmarking with international technology roadmaps, our production capability is consistently optimized to meet new product requirements. Unimicron provides unique and competitive technology through swift adoption of new production techniques to meet our customer satisfaction. Unimicron also endeavor in developing low cost and environmental friendly production process. It is our goal to build our core competence based on technology innovation and intellectual properties.

Some of the new PCB R&D technologies are listed below: B2it (Buried bump interconnection technology), Conductive metal paste, Carbon ink circuit, Metal bump technology, SAP (Semi-additive process), and Copper filled via.

Some of the new IC Carrier R&D technologies are listed below: Ultra fine pitch circuit, SPOP (Solder Plated On Pad) technology, Coreless technology, and embedded passive substrate.

The current line/space capability for SAP technology is 14/14um. We are improving it toward 10/10um resolution to meet future design rules of advanced FCBGA products. For CSP substrates, the MESA process is running HVM with line/space capability at 25/25um while PSAP process with line/space capability at 20/20um level is under developing.

SPOP

The current SPOP technology was developed to meet FC substrate’s fine bump pitch requirements and is now in mass production for 150um bump pitch. Extension of SPOP technology into FCCSP and FCBGA 130um bump pitch products are underway.

Coreless

The Coreless technology provides solution for multilayer super thin substrates. Currently we have completed the prototype development.

Embedded passive substrate

	Unimicron has developed technology for embedding MLCC or IPD components into CSP or FCBGA substrate products. The potential applications include IC components for portable device, graphic and network products. Better signal integrity and lower signal noise are expected.

 Since its establishment, Unimicron R&D Department has been making great endeavors to develop world-leading products in the fields of PCB and IC carrier. In terms of PCB application, Unimicron has made steady and continuous progress in via plating and High Density Interconnect (HDI) related technologies. As a result, Unimicron is among the few leading suppliers who can offer the advanced “Every Layer Inter-Connection” technology for high end electronic devices. We currently offer HDI products with layer counts ranging from 10 to 14. There are also various special PCB products available from Unimicron:

1.  Rigid-flex board: adding flex board component within HDI structure that make the product design and application more flexible
2. 3D MID: forming copper patterns on stereo plastic parts after their mold injecting formation. This technology is currently being designed on cell phone and notebook antenna.
3. Embedded products: including various kinds of embedded components like passives, active die, EIPD, and EWLP products.

In addition, there are also new products in field of connectors, optical-electric circuit board, PCB for automobile, high thermal-dissipation substrate, high layer-count PCB and notebook HDI. The patent counts and technology capability in these area are all among world leading position.