Product Development

Since its establishment the Unimicron R&D department has been making great endeavors to develop world-leading technology in the fields of PCB and IC carrier products. In terms of PCB technology, Unimicron has made steady and continuous progress, and has established a leading role in the fields of High Density Interconnect (HDI) and High Layer Count products. As for IC substrates, Unimicron has focused on the fields of flip chip substrate, multi-layer CSP, high density MCM/SIP, embedded passives, thermal BGA, super thin substrate and fruitful progress has been achieved.