Features

• Package Size: 21 x 21mm up to 35 x 35 mm 
• Thickness: 0.36mm 到 0.58mm 
• Ball Pitch: 0.8mm, 1.0mm, 1.27mm 
• Line & Space down to 25/25 um 
• RoHS compliance materials 
• Layer count from 2 layer up to HDI 6 layers 
• Structure: single die, multiple die, POP, Embeded Active Die.

Applications

• The package of microprocessor, controllers, ASICs, gate arrays, memory, DSPs, PLSs, communications, networking, graphics and PC chipsets.

Benefits

• High interconnect capacity 
• Low packaging profile 
• High density 
• Electrical and thermal enhancement