Features

• Package Size: 3 x 3 mm up to 15 x 15 mm 
• Line & Space 15/15 um 
• Bump Pitch down to 140 um 
• Impedance control for critical signal traces 
• Structure range from 2 layers to 8 layers 
• For products demanding high density and reliability 
• For small package size with high electric performance product

Applications

• Hand-held, Mobile, Net working, Smart phone, Consumer electronics and DTV …etc

Benefits

• High I/O Count and Short Interconnects.
• High layout density requirement.
• Cost down - Die size can be reduced.