Ridid PCB
HDI PCB 1+N+1
HDI PCB 2+N+2
ELIC
B2IT
Multi-layer PCB
Heavy Copper PCB
Backpanel / High Layer Count PCB
Rigid-flex PCB
Flexible Printed Circuit
FPC
IC Carrier
Wire Bond Substrate
CSP
PBGA
BOC
Memory Module
SiP/RF Module
Flip Chip Substrate
FCBGA
FCCSP
POP Substrate
POP Substrate
Hybrid (WB+FC) Substrate
Hybrid (WB+FC) Substrate
IC Test & Burn-In
IC BURN-IN & TEST Total Service
IC BURN-IN Service
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Ridid PCB
Heavy Copper PCB
Features
Excellent heat loss capability
High credible reliability (resist high voltage, high temperature and high humidity)
The base copper thickness of inner layer and out layer: >3oz
Excellent electro conductibility and high reliability of Inner layer copper finger , The entity inner copper thickness can reach 18oz;
Applications
Devices such as Fuse box/Engine control unit
TEL:886-3-3500386 FAX:886-3-3500372
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