Features

• Package Size: 10 x 10mm ~ 14 x 14mm 
• Applied in products with thickness 0.3 mm and structure up to 4 layers 
• BGA ball pitch : 0.4mm ~ 0.5mm 
• POP Ball Pitch : 0.5mm ~ 0.65mm 
• Line & Space down to 15/15 um 
• RoHS compliance materials 
• Structure: single to multiple dies for wire bonding, flip chip or mix type connect

Applications

• Multi-media Controller 
• Application Processor