Ridid PCB
HDI PCB 1+N+1
HDI PCB 2+N+2
ELIC
B2IT
Multi-layer PCB
Heavy Copper PCB
Backpanel / High Layer Count PCB
Rigid-flex PCB
Flexible Printed Circuit
FPC
IC Carrier
Wire Bond Substrate
CSP
PBGA
BOC
Memory Module
SiP/RF Module
Flip Chip Substrate
FCBGA
FCCSP
POP Substrate
POP Substrate
Hybrid (WB+FC) Substrate
Hybrid (WB+FC) Substrate
IC Test & Burn-In
IC BURN-IN & TEST Total Service
IC BURN-IN Service
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Ridid PCB
ELIC ( Every Layer Interconnection)
Features
Every layer via structure maximizes design freedom
Copper filled via provides better reliability
Superior electrical characteristics
Cu bump and metal paste technologies for very thin board
Applications
Cellular phone, UMPC, MP3 Player, PMP, GPS, memory card
Benefits
Advanced equipment and leading technology
Large capacity support
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