hsK׳sO
(ELIC, Every Layer Interconnection)
Features
- Every layer via structure maximizes design freedom
- Copper filled via provides better reliability
- Superior electrical characteristics
- Cu bump and metal paste technologies for very thin board
Applications
- Cellular phone, UMPC, MP3 Player, PMP, GPS, memory card
|
|
|
TEL:886-3-3500386 FAX:886-3-3500372