Ridid PCB
HDI PCB 1+N+1
HDI PCB 2+N+2
ELIC
B2IT
Multi-layer PCB
Heavy Copper PCB
Backpanel / High Layer Count PCB
Rigid-flex PCB
Flexible Printed Circuit
FPC
IC Carrier
Wire Bond Substrate
CSP
PBGA
BOC
Memory Module
SiP/RF Module
Flip Chip Substrate
FCBGA
FCCSP
POP Substrate
POP Substrate
Hybrid (WB+FC) Substrate
Hybrid (WB+FC) Substrate
IC Test & Burn-In
IC BURN-IN & TEST Total Service
IC BURN-IN Service
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Ridid PCB
HDI PCB 2+N+2
Features
Suitable for BGA with smaller ball pitch and higher I/O counts
Increase routing density in complicated design
Thin board capabilities
Lower Dk / Df material enables better signal transmission performance
Copper filled via
Applications
Cellular phone, PDA, UMPC, portable game console, DSC, camcorder
Benefits
World’s largest HDI manufacturer
Well experienced manufacturer with good yield
Multiple plants increase production output in short time
TEL:886-3-3500386 FAX:886-3-3500372
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