Features

• Suitable for BGA with smaller ball pitch and higher I/O counts
• Increase routing density in complicated design
• Thin board capabilities
• Lower Dk / Df material enables better signal transmission performance
• Copper filled via

Applications

• Cellular phone, PDA, UMPC, portable game console, DSC, camcorder

Benefits

• World’s largest HDI manufacturer
  1. Well experienced manufacturer with good yield
  2. Multiple plants increase production output in short time