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FPC

Wire Bond Substrate

Flip Chip Substrate

POP Substrate

Hybrid (WB+FC) Substrate

Hybrid (WB+FC) Substrate

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IC BURN-IN Service

Product line	Package type	Burn-in board size
DDR	E66 TSOP	450*570 mm
SDRAM	E50 TSOP	450*570 mm
SDRAM	E54 TSOP@@E86 TSOP	290*590 mm
EDO DRAM	E40 SOJ@@@E42 SOJ E24/26 TSOP@E24/26 SOJ	180*590 mm
EDO DRAM	E44/50 TSOP	290*590 mm
FPM DRAM	E20/26 TSOP	180*590 mm
LOW POWER/PSEUDO SRAM	E36 BGAE48 BGA	290*590 mm
LOW POWER/HIGH SPEED SRAM	E32 TSOP	180*590 mm
LOW POWER SRAM	E32 TSSOP@E28 SOJ E32 SOJ@@ E28 SOP E32 SOP	180*590 mm
LOW POWER SRAM	E44 TSOP	290*590 mm

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