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Flip Chip
Features
- Package Size : 12 x 12mm up to 55 x 55 mm
- Line & Space 15/15 um down to 10/12 um
- Bump Pitch down to 150 um
- Impedance control for critical signal traces
- Structure range from 1/2/1 to 6/4/6
- For products demanding high reliability
Applications
- CPU, GPU and ChipSet for PC application
- CPU, GPU for Game Console (eg. X-Box, PS3, Wii……)
- Infrastructure application (eg. Network, Base Station……)
- Super computer
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