Features

• Package Size : 12 x 12mm up to 55 x 55 mm
• Line & Space 15/15 um down to 10/12 um
• Bump Pitch down to 150 um
• Impedance control for critical signal traces
• Structure range from 1/2/1 to 6/4/6
• For products demanding high reliability

Applications

• CPU, GPU and ChipSet for PC application
• CPU, GPU for Game Console (eg. X-Box, PS3, Wii……)
• Infrastructure application (eg. Network, Base Station……)
• Super computer