Ridid PCB
HDI PCB 1+N+1
HDI PCB 2+N+2
ELIC
B2IT
Multi-layer PCB
Heavy Copper PCB
Backpanel / High Layer Count PCB
Rigid-flex PCB
Flexible Printed Circuit
FPC
IC Carrier
Wire Bond Substrate
CSP
PBGA
BOC
Memory Module
SiP/RF Module
Flip Chip Substrate
FCBGA
FCCSP
POP Substrate
POP Substrate
Hybrid (WB+FC) Substrate
Hybrid (WB+FC) Substrate
IC Test & Burn-In
IC BURN-IN & TEST Total Service
IC BURN-IN Service
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BOC
BOC
Features
Wire Bond / Flip Chip BGA
JEDEC Standard 0.65 mm Ball Pitch
Punched slots for Low cost and High Accuracy position
Low cost routed slots
RoHS compliance material set
Applications
DDR II & III, DDR IV
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