Features

• Package Size : 3 x 3mm up to 10 x 12 mm
• Compatible with BGA & LGA
• Thermal enhanced through holes for high efficient heat conduction
• Wire bondable on micro vias
• Impedance control of critical lines
• Variety surface finishing for wire bonding, flip chip or mix type connect
• Thin substrate

Applications

• PA Module
• Transceiver
• Blue Tooth
• Front End Module
• GPS
• One chip solution with Baseband & RF features