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>Products>IC Carrier

SiP/RF Module

Features

  • Package Size : 3 x 3mm up to 10 x 12 mm
  • Compatible with BGA & LGA
  • Thermal enhanced through holes for high efficient heat conduction
  • Wire bondable on micro vias
  • Impedance control of critical lines
  • Variety surface finishing for wire bonding, flip chip or mix type connect
  • Thin substrate

Applications

  • PA Module
  • Transceiver
  • Blue Tooth
  • Front End Module
  • GPS
  • One chip solution with Baseband & RF features