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SiP/RF Module
SiP/RF Module
Features
Package Size : 3 x 3mm up to 10 x 12 mm
Compatible with BGA & LGA
Thermal enhanced through holes for high efficient heat conduction
Wire bondable on micro vias
Impedance control of critical lines
Variety surface finishing for wire bonding, flip chip or mix type connect
Applications
PA Module, Transceiver, Blue Tooth
Front End Module, GPS, One chip solution with Baseband & RF features
TEL:886-3-3500386 FAX:886-3-3500372
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