Features

• Package Size : 3 x 3mm up to 10 x 12 mm 
• Compatible with BGA & LGA 
• Thermal enhanced through holes for high efficient heat conduction 
• Wire bondable on micro vias 
• Impedance control of critical lines 
• Variety surface finishing for wire bonding, flip chip or mix type connect

Applications

• PA Module, Transceiver, Blue Tooth
• Front End Module, GPS, One chip solution with Baseband & RF features