Features

• Package Size : 10 x 10mm ~ 14 x 14mm
• Applied in products with thickness 0.3 mm and structure up to 4 layers
• BGA ball pitch : 0.4mm ~ 0.5mm
• POP Ball Pitch : 0.5mm ~ 0.65mm
• Line & Space down to 25/25 um
• RoHS compliance materials
• Structure : single to multiple dies for wire bonding, flip chip or mix type connect

Applications

• Multi-media Controller
• Application Processor