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Flip Chip BGA

   

Features

  • Package Size: 15 x 15 mm up to 55 x 55 mm
  • Line & Space 14/14 um
  • Bump Pitch down to 150 um
  • Impedance control for critical signal traces
  • Structure range from 1/2/1 to 6/4/6 and Coreless
  • For products demanding high reliability

Applications

  • CPU, GPU and Chipset for PC application
  • CPU, GPU for Game Console (eg. X-Box, PS3, Wii…)
  • DTV Chip Controller, Bru-Ray Chip Controller
  • Infrastructure application (eg. Network, Base Station…)
  • Super computer, DDR
  • ASICs

Benefits

  • High circuit density design can decrease the die size and cost.
  • Good electrical performance.
  • Good ability for heat dissipation.