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POP

Features

  • Package Size : 10 x 10mm ~ 14 x 14mm
  • Applied in products with thickness 0.3 mm and structure up to 4 layers
  • BGA ball pitch : 0.4mm ~ 0.5mm
  • POP Ball Pitch : 0.5mm ~ 0.65mm
  • Line & Space down to 25/25 um
  • RoHS compliance materials
  • Structure : single to multiple dies for wire bonding, flip chip or mix type connect

Applications

  • Multi-media Controller
  • Application Processor