Features

• Package Size: 15 x 15 mm up to 55 x 55 mm
• Line & Space 14/14 um
• Bump Pitch down to 150 um
• Impedance control for critical signal traces
• Structure range from 1/2/1 to 6/4/6 and Coreless
• For products demanding high reliability

Applications

• CPU, GPU and Chipset for PC application
• CPU, GPU for Game Console (eg. X-Box, PS3, Wii…)
• DTV Chip Controller, Bru-Ray Chip Controller
• Infrastructure application (eg. Network, Base Station…)
• Super computer, DDR
• ASICs

Benefits

• High circuit density design can decrease the die size and cost.
• Good electrical performance.
• Good ability for heat dissipation.