Features

• Package Size: 3 x 3mm up to 19 x 19 mm
• Thickness: 0.10mm 到 0.36mm
• Ball Pitch: 0.8mm, 0.65mm, 0.5mm, 0.4mm, 0.3mm
• Line & Space down to 15/15 um
• RoHS compliance materials
• Layer count from 2 layer up to HDI 6 layers
• Structure: single die, multiple die, POP, Embeded Active Die.
• Designed for strict reliability test including Drop Test

Applications

• Digital Baseband
• Power Management
• Graphic Processor
• Multimedia Controller
• Graphic Processor

Benefits

• Small scale and light weight. 
• Low inductance, low capacitance and enhanced electrical Performance.