Features

• Better reliability, signal integrity, noise reduction, and impedance control
• Reduces mechanical space and device weight
• Improves design freedom
• HDI microvia
• Cost-saving alternative to multi-layer FPC

Applications

• Cellular phone, bluetooth headset, LCM, DSC, camera module, MP3 player, game console, battery

Benefits

• Dedicated production plant 
• HDI capability and capacity 
• Consulting service to help customer design