Features

• Largest panel format ~ 24” x 36”
• Board thickness up to 0.375”
• High layer count up to 40 layers
• Quick turn, prototype and production volume
• ISO 9001, ISO14000, TL9000-HW/R3.5 & TS16949
• HDI microvia

Applications

• Telecommunication, high-end computing, industrial equipment, consumer electronics

Benefits

• Advanced equipment for Backpanel and HLC production
• Advanced technology for Via in Pad (VIP)、Back Drill and HLC+HDI
• Consulting service to help customer design