|
|
 |
Backpanel / High Layer Count PCB
Features
- Largest panel format ~ 24” x 36”
- Board thickness up to 0.47”
- High layer count up to 60 layers
- Quick turn, prototype and production volume
- ISO 9001, ISO14000, TL9000-HW/R3.5 & TS16949
- HDI microvia
|
Applications
- Telecommunication, high-end computing, industrial equipment, consumer electronics
Benefits
- Advanced equipment for Backpanel and HLC production
- Advanced technology for Via in Pad (VIP)、Back Drill and HLC+HDI
- Consulting service to help customer design
|
|
| |
|
|
 |
|