Features

• From 2 to 12 layers
• Supports fine line & narrow pitch CSP mounting
• Good impedance control
• Green material and process capabilities

Applications

• NB, server, printer, graphic card, DRAM module, game console, STB, TV, cordledd phone,networking, OA, automotive

Benefits

• Large capacity support
• Better logistics support with plants in East, South China and Taiwan
• Multiple plants increase production output in short time