Features

• Suitable for BGA with lower I/O counts
• Fine line, microvia and registration technologies capable of 0.4 mm ball pitch
• Qualified material and surface treatment for Lead-free process
• Excellent mounting stability and reliability
• Copper filled via
  

Applications

• Cellular phone, UMPC, MP3 Player, PMP, GPS, memory card

Benefits

• World’s largest HDI manufacturer
  1. Over 10 years experience in HDI manufacturing
  2. Multiple plants increase production output in short time