Ridid PCB
HDI PCB 1+N+1
HDI PCB 2+N+2
ELIC
B2IT
Multi-layer PCB
Heavy Copper PCB
Backpanel / High Layer Count PCB
Rigid-flex PCB
Flexible Printed Circuit
FPC
IC Carrier
Wire Bond Substrate
CSP
PBGA
BOC
Memory Module
SiP/RF Module
Flip Chip Substrate
FCBGA
FCCSP
POP Substrate
POP Substrate
Hybrid (WB+FC) Substrate
Hybrid (WB+FC) Substrate
IC Test & Burn-In
IC BURN-IN & TEST Total Service
IC BURN-IN Service
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Ridid PCB
HDI PCB 1+N+1
Features
Suitable for BGA with lower I/O counts
Fine line, microvia and registration technologies capable of 0.4 mm ball pitch
Qualified material and surface treatment for Lead-free process
Excellent mounting stability and reliability
Copper filled via
Applications
Cellular phone, UMPC, MP3 Player, PMP, GPS, memory card
Benefits
World’s largest HDI manufacturer
Over 10 years experience in HDI manufacturing
Multiple plants increase production output in short time
TEL:886-3-3500386 FAX:886-3-3500372
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