Home a   English Chinese my unimicron online
Unimicron Logo
news about Unimicron Technology Products Quality Human Resource Contact Us

HDI PCB 1+N+1

Features

  • Suitable for BGA with lower I/O counts
  • Fine line, microvia and registration technologies capable of 0.4 mm ball pitch
  • Qualified material and surface treatment for Lead-free process
  • Excellent mounting stability and reliability
  • Copper filled via

Applications

  • Cellular phone, UMPC, MP3 Player, PMP, GPS, memory card