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Rigid PCB Rigid PCB
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Flexible Printed Circuit Flexible
Printed Circuit
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IC Carrier IC Carrier
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IC Test & Burn-In IC Test &
Burn-In
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Manufacturing Site
Unimicron Suzhou Unimicron-FPC Unimicron (KS) Unimicron (SZ)
Suzhou
FPC
KS
SZ
 
News title
 
news Unimicron received “Best Employment” Gold medal award by Taoyuan County Government...(2013/11/12)
news Unimicron was rewarded 2012 Outstanding Performance Award from SPIL...(2013/10)
TJ Tseng, Chairman & CEO, leads a team to participate in the 2013 Asian Network for Quality (ANQ) Congress held from Oct 16 to 17 in Bangkok, Thailand..(2013/10/25)
2013 Unimicron Technology Forum..(2013/10/22)
TJ Tseng, Chairman & CEO , made introductory speech for members of IAQ on Oct. 18 in Bangkok, Thailand...(2013/10/18)
TJ Tseng, Chairman & CEO delivered “Strategy formulation & TQM Promotion” speech to top management of SCG (Thailand) CO., Ltd...(2013/10/15)
CSP

We currently offer some of the most advanced process and products available , including single or multi-layer CSP (chip scale package), BGA (ball grid array), SIP (system in package), Embedded Passive Product, super thin substrate, and highly reliable Flip Chip Substrate. such as mobile communication device, telecom device, or laptop computers.

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National Quality Affirmation
Unimicron is dedicated to continuous breakthrough as part of our company-philosophy and quality policy.
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