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[ 2007/06/29] Ranked 36 in Tai....
[ 2007/06/29] We have a New we....
[ 2007/06/29] Ranked 73 in Tai....
We currently offer some of the most advanced process and products available , including single or multi-layer CSP (chip scale package), BGA (ball grid array), SIP (system in package), Embedded Passive Product, super thin substrate, and highly reliable Flip Chip Substrate. such as mobile communication device, telecom device, or laptop computers.
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Unimicron is dedicated to continuous breakthrough as part of our company-philosophy and quality policy.
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