We currently offer some of the most advanced
process and products available , including single
or multi-layer CSP (chip scale package), BGA (ball grid
array), SIP (system in package), Embedded Passive Product,
super thin substrate, and highly reliable Flip Chip Substrate. such
as mobile communication device, telecom device, or laptop
computers.
National
Quality Affirmation
Unimicron is dedicated to continuous
breakthrough as part of our company-philosophy and quality
policy.
people visited.
TEL:886-3-3500386 FAX:886-3-3500372
copyright 2007 Unimicron Corporation. All Rights Reserved
TEL:886-3-3500386 FAX:886-3-3500372