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We currently offer some of the most advanced process and products available , including single or multi-layer CSP (chip scale package), BGA (ball grid array), SIP (system in package), Embedded Passive Product, super thin substrate, and highly reliable Flip Chip Substrate. such as mobile communication device, telecom device, or laptop computers.

National Quality Affirmation

Unimicron is dedicated to continuous breakthrough as part of our company-philosophy and quality policy.